TI delivers high resolution audio quality with a minimum size quad amplifier
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Beijing, December 6, 2016 - Texas Instruments (TI) recently introduced the first 2.1-MHz Class D audio amplifier for automotive applications. The TAS6424-Q1 is compact and supports high-resolution 96-kHz digital inputs for low-distortion, high-fidelity audio in automotive infotainment applications. For more information, please visit
Compared to existing Class D solutions, the TAS6424-Q1 can use smaller external filters and remove 18 external components.
This reduces system size and reduces costs. With a maximum output power of 75W per channel, the device has the industry's highest slew rate and is the only audio amplifier that converts over the AM band.
Key features and benefits of the TAS6424-Q1 Class D audio amplifier:
• Reduced electromagnetic interference (EMI): The conversion of the AM band does not require the use of complex avoidance schemes, which mitigates the electromagnetic compatibility (EMC) design and enables the system to meet the requirements of the International Committee of Radio Interference (CISPR) Class 25 5EMC.
· Support low impedance: maintain stable audio playback while low impedance load up to 2 ohms.
Advanced AC Load Diagnostics and Line Driver Mode: The TAS6424-Q1 features fine on-chip phase and impedance measurements, allowing designers to configure the device with a variety of outputs such as woofer, tweeter, and line level connections.
• Audio quality enhancement: High frequency switching improves distortion, power supply rejection and dynamic response.
• Noise reduction: The integrated digital-to-analog converter delivers system output noise as low as 42uVrms for automotive design such as external audio amplifiers and audio bodies.
· Better thermal performance: Compared to Class AB amplifiers, the power consumption is reduced by up to 60%, greatly reducing the use of fans or large heat sinks.
Get started with the tools and support you need for your design
The PurePathTM Console graphical user interface helps designers easily configure the TAS6424-Q1. To simulate and optimize the device, designers can download the IBIS model or request the TAS6424-Q1 evaluation module.
Packaging and supply
The PowerPADTM Thermally Enhanced Reduced Outline Package (HSSOP) TAS6424-Q1 is available now from TI stores and authorized resellers.
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