[High-tech LED reporter / Wang Cairong] In recent years, domestic packaging manufacturers are making full use of their localization and price advantages, and gradually gaining market quality by gradually introducing the lighting enterprise supply chain to gradually seize the market share of imported devices.
At the same time, the diversification of packaging forms also makes the differentiation between enterprises more obvious, which is more conducive to domestic device manufacturers to build their own brands.
However, the other side of the market is also extremely cruel, especially in the middle and low-end market, the competition between enterprises is further intensified, and the price of devices has fallen sharply. Some manufacturers have robbed the market, or copied plagiarism, maliciously cut prices, or pushed old and new.
The entire packaging market is in full swing. With the increasing reshuffle of the LED industry in recent years, coupled with the impact of new technologies such as EMC packaging and chip-level packaging technology, the future development of the packaging industry is full of uncertainties.
On the morning of November 26th, the 2013 High-tech LED Conference sponsored by Zhongwei Optoelectronics Co., Ltd. featured a special session on "Packaging Devices, Equipment and Materials". Gwen, the general manager of G20-LED Summit, Jingtai Optoelectronics Co., Ltd. Keynote speech on the trend of large packaging and technology trends in COB devices.
"In fact, the domestic packaging industry is still relatively fragmented, and it is difficult to have leading enterprises in a short period of time. The overall market structure is still in a stage of change. Hongli Optoelectronics, Guoxing Optoelectronics and other peers have already expanded in large-scale production. The decisive factors for the competition of packaging enterprises in the future will be Will be management capabilities, cost control, scale and brand, etc.. Gong Wen told the "High-tech LED" reporter.
For the future development of the domestic LED packaging industry, Gong Wen proposed ten applications including medium power to become mainstream packaging, EMC, modified PPA and thermoplastic PPT in packaging, chip overcurrent density application, and power supply scheme. Megatrends and will be elaborated in this speech.
In addition, in the field of packaging, COB packaging is being favored by more and more enterprises due to its unique cost and technical advantages. Compared with the traditional package form, the COB package has the characteristics of small thermal resistance, high luminous flux density, small glare and uniform illumination.
At the beginning of 2012, Jingtai Optoelectronics took the lead in the industry to propose the MLCOB concept and successfully developed a variety of light engines based on MLCOB technology. “The efficiency of this product has reached 160lm/W, which is the highest light-efficiency product in the COB package.†Gong Wen told reporters that the COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume. Achieving greater power in a small area will be an important trend in the future development of the LED packaging industry.
At the same time, the diversification of packaging forms also makes the differentiation between enterprises more obvious, which is more conducive to domestic device manufacturers to build their own brands.
However, the other side of the market is also extremely cruel, especially in the middle and low-end market, the competition between enterprises is further intensified, and the price of devices has fallen sharply. Some manufacturers have robbed the market, or copied plagiarism, maliciously cut prices, or pushed old and new.
The entire packaging market is in full swing. With the increasing reshuffle of the LED industry in recent years, coupled with the impact of new technologies such as EMC packaging and chip-level packaging technology, the future development of the packaging industry is full of uncertainties.
On the morning of November 26th, the 2013 High-tech LED Conference sponsored by Zhongwei Optoelectronics Co., Ltd. featured a special session on "Packaging Devices, Equipment and Materials". Gwen, the general manager of G20-LED Summit, Jingtai Optoelectronics Co., Ltd. Keynote speech on the trend of large packaging and technology trends in COB devices.
"In fact, the domestic packaging industry is still relatively fragmented, and it is difficult to have leading enterprises in a short period of time. The overall market structure is still in a stage of change. Hongli Optoelectronics, Guoxing Optoelectronics and other peers have already expanded in large-scale production. The decisive factors for the competition of packaging enterprises in the future will be Will be management capabilities, cost control, scale and brand, etc.. Gong Wen told the "High-tech LED" reporter.
For the future development of the domestic LED packaging industry, Gong Wen proposed ten applications including medium power to become mainstream packaging, EMC, modified PPA and thermoplastic PPT in packaging, chip overcurrent density application, and power supply scheme. Megatrends and will be elaborated in this speech.
In addition, in the field of packaging, COB packaging is being favored by more and more enterprises due to its unique cost and technical advantages. Compared with the traditional package form, the COB package has the characteristics of small thermal resistance, high luminous flux density, small glare and uniform illumination.
At the beginning of 2012, Jingtai Optoelectronics took the lead in the industry to propose the MLCOB concept and successfully developed a variety of light engines based on MLCOB technology. “The efficiency of this product has reached 160lm/W, which is the highest light-efficiency product in the COB package.†Gong Wen told reporters that the COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume. Achieving greater power in a small area will be an important trend in the future development of the LED packaging industry.
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