Hitachi, Ltd. and Hitachi Automotive Systems announced on September 28, 2015 that they have developed high-efficiency, high-power inverters for hybrid and pure electric vehicles. Compared with Hitachi's original products, the power consumption of the new product is reduced by 60%, and the power capacity under the same volume is expanded by about 2 times. Helps achieve long distance travel and improve acceleration performance.
This time, Hitachi developed the full sic power module and the HEV/EV inverter using this module using the previously developed sic and GaN parallel packaging technology and double-sided cooling power module technology. In order to equalize the switching time of each sic power semiconductor, the previously developed parallel packaging technology was used. In other words, a wiring board having the same length of control signal lines for accessing the respective sic power semiconductors has been developed, and the resistance characteristics of the respective wirings are equalized. Thereby, the low resistance characteristics of the sic power semiconductor can be fully utilized, and the power capacity can be expanded.
In addition, the inverter developed this time uses a structure in which overlapping wiring is used to reverse the direction of load current and is packaged in a can-shaped metal cooling fan of a double-sided cooling type power module. In this way, the magnetic field formed by the built-in wiring is eliminated by the cooling fan, and the magnetic field energy accumulated in the wiring is reduced.
In addition, the double-sided cooling type full sic module developed this time will be exhibited at the "2014 44th Tokyo Motor Show" held at the Tokyo Amihi International Convention and Exhibition Center on October 30th.
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