ã€æ–‡âˆ•æœ±æ˜¥ä¼Ÿã€‘ COB device is a LED personalized integrated light source device newly developed in response to commercial lighting, industrial lighting, etc., and has been widely used in track lights, downlights, PAR lights, spotlights, industrial and mining lights, street lamps, etc. use.
As the absolute protagonist of the next-generation LED light source, the heat dissipation problem has always affected the development of COB packaging.
Some insiders pointed out that COB devices have smaller light-emitting surface and higher power, which leads to more concentrated heat. If the internal heat is not well dispersed, it will affect the light efficiency and life of the lamp.
It can be said that the quality of the heat dissipation directly determines the quality of the COB light source, and the heat dissipation performance depends largely on the choice of the heat sink substrate.
Therefore, from the beginning of the COB device to the present, the choice of heat sink substrate materials has been constantly changing. From the early copper substrate to the aluminum substrate, to the ceramic substrate used by some companies, and then back to the metal material.
At present, the mainstream heat sink substrate of COB is an aluminum substrate.
“Aluminum substrate accounts for about 80% of COB's heat-dissipating substrate material.†Lu Jiawen, the domestic sales manager of Guangzhou Silicon Energy Lighting Co., told reporters that the most important material two years ago was ceramics, especially some Japanese packaging device manufacturers. .
The reporter learned that Citizen Japan has introduced a multi-chip product, which uses COB technology to store a plurality of blue LED chips in the package body, achieving high heat dissipation performance and bringing COB technology to the market again. In addition, the mass production of Sharp Ceramics COB, another major Japanese manufacturer, has also made it one of the few companies in Asia to produce ceramic COB light sources.
“Because the current mainstream market is dominated by aluminum substrates, the demand for ceramic substrates is still far from enough.†Yang Hong, general manager of Shenzhen Sunshine Electric Co., Ltd. said that the current use of ceramic packaging is still limited, mainly in some subdivisions. The field includes plant lighting and luminaires with concentrated light effects and high heat dissipation requirements.
The biggest advantage of ceramic COB is that it has good insulation and can withstand high-voltage breakdown, but at the same time, the disadvantages are also obvious, such as fragile and difficult to process.
It is worth noting that ceramic COB is significantly inferior to aluminum substrates in terms of heat dissipation. Even the best ceramics have a thermal conductivity of 40 W/(K*m). The thermal conductivity of aluminum is 200W/(K*m), and the thermal conductivity of copper is 400W/(K*m).
Based on this, many companies have begun to try to include copper in the selection of heat-dissipating substrate materials.
“We use solid-liquid method, metallurgical combination of copper and aluminum to overcome the problem of copper and aluminum stratification under quenching and hot conditions, and developed the most ideal COB package heat sink substrate material.â€
Guo Zhenluo, sales manager of Shenzhen Yuguangyu Technology Co., Ltd., said that the thermal conductivity of copper and aluminum substrates produced by them can reach 210W/(K*m).
The company's copper-aluminum substrate is based on the high thermal conductivity of copper but the price is expensive, and the heat dissipation per unit volume is worse than aluminum.
In fact, for this copper-aluminum meets the heat-dissipating substrate, many COB packaging companies are still holding a wait-and-see attitude. Some companies specializing in the production of LED heat-dissipating substrates are less optimistic about this material.
"With this heat-conducting substrate, the thermal resistance may be reduced, but the overall cost is improved." A research and development staff of a professional COB package in Shenzhen told reporters that improving the cost performance of COB devices should not only consider the improvement of parameters. There is also a need to consider cost issues, not to mention a material that is not very mature.
Yin Hui, director of sales of Ningbo Shengpu Optoelectronics, also told reporters, "We have been paying attention to copper and aluminum plates very early, but the technical difficulties have been difficult to overcome, and the price of copper and aluminum plates is relatively cheap." At the same time, he said that related technologies Before maturity, the enhanced spectrum optoelectronics will only try this substrate in small batches.
One key that cannot be ignored is the industry's application of heat-dissipating materials, focusing only on the heat dissipation coefficient, while ignoring the thermal resistance value.
"Whether it is a ceramic substrate or an aluminum substrate, a silver layer is applied to the surface for the purpose of conduction, so that a thermal resistance layer is formed between the heat source and the heat dissipation substrate," Lu Jiawen said.
The dielectric layer on most common heat-dissipating substrates has little thermal conductivity or even thermal conductivity, so that heat cannot be conducted from the LED chip to the heat-dissipating substrate, and the entire heat-dissipating channel cannot be unblocked. The heat accumulation will quickly lead to the LED chip. Invalid.
Therefore, the thermal resistance treatment is not good, not only does the heat not easily dissipate, but the silver-plated material also produces a common "vulcanization" phenomenon, and even a dead light.
The mirror aluminum heat sink substrate is used in this case in a large number of COB packages.
“Mirror aluminum substrate is a material developed based on traditional PCB hot spot separation technology and is specially used for high-power integrated light source such as COB.†Jian Yucang, general manager of Shenzhen Ruwei Electronics Co., Ltd., said that the use of mirror aluminum substrate can not only overcome Vulcanization, and faster heat dissipation, and light efficiency can be significantly improved.
It is understood that the mirror-coated aluminum COB package device directly attaches the chip to the mirror-processed aluminum substrate, which not only reflects other astigmatism, but also improves the light efficiency, and reduces the thermal resistance in the middle. The heat is directly from the chip. Passed to the heat sink substrate, the heat dissipation performance is significantly improved.
At the same time, the LED wire is wound on the outer insulating layer, and the light-emitting area and the solder joint are separated. Even if the solder joint is vulcanized, it will not affect the light emission of the chip.
"This kind of aluminum substrate is a boon for COB packaging companies, not only can improve the quality of device products, but also save them a lot of cost." Liu Wei, chairman of Zhejiang Yuanda Electronic Development Co., Ltd. said that Yuanda Electronics has realized In mass production, it can fully meet the needs of customers.
Benefiting from the growth of downstream demand, especially the demand for integrated light sources in the commercial lighting field is growing rapidly, and the demand for COB packaging is further improved. GLII expects that the COB packaging market this year will be expected to reach 15% to 20%.
Under the rapid growth of COB light source, the future heat sink substrate market will be more active. Whether the mirror aluminum substrate can withstand the challenges of various materials, you have to look at it.
As the absolute protagonist of the next-generation LED light source, the heat dissipation problem has always affected the development of COB packaging.
Some insiders pointed out that COB devices have smaller light-emitting surface and higher power, which leads to more concentrated heat. If the internal heat is not well dispersed, it will affect the light efficiency and life of the lamp.
It can be said that the quality of the heat dissipation directly determines the quality of the COB light source, and the heat dissipation performance depends largely on the choice of the heat sink substrate.
Therefore, from the beginning of the COB device to the present, the choice of heat sink substrate materials has been constantly changing. From the early copper substrate to the aluminum substrate, to the ceramic substrate used by some companies, and then back to the metal material.
At present, the mainstream heat sink substrate of COB is an aluminum substrate.
“Aluminum substrate accounts for about 80% of COB's heat-dissipating substrate material.†Lu Jiawen, the domestic sales manager of Guangzhou Silicon Energy Lighting Co., told reporters that the most important material two years ago was ceramics, especially some Japanese packaging device manufacturers. .
The reporter learned that Citizen Japan has introduced a multi-chip product, which uses COB technology to store a plurality of blue LED chips in the package body, achieving high heat dissipation performance and bringing COB technology to the market again. In addition, the mass production of Sharp Ceramics COB, another major Japanese manufacturer, has also made it one of the few companies in Asia to produce ceramic COB light sources.
“Because the current mainstream market is dominated by aluminum substrates, the demand for ceramic substrates is still far from enough.†Yang Hong, general manager of Shenzhen Sunshine Electric Co., Ltd. said that the current use of ceramic packaging is still limited, mainly in some subdivisions. The field includes plant lighting and luminaires with concentrated light effects and high heat dissipation requirements.
The biggest advantage of ceramic COB is that it has good insulation and can withstand high-voltage breakdown, but at the same time, the disadvantages are also obvious, such as fragile and difficult to process.
It is worth noting that ceramic COB is significantly inferior to aluminum substrates in terms of heat dissipation. Even the best ceramics have a thermal conductivity of 40 W/(K*m). The thermal conductivity of aluminum is 200W/(K*m), and the thermal conductivity of copper is 400W/(K*m).
Based on this, many companies have begun to try to include copper in the selection of heat-dissipating substrate materials.
“We use solid-liquid method, metallurgical combination of copper and aluminum to overcome the problem of copper and aluminum stratification under quenching and hot conditions, and developed the most ideal COB package heat sink substrate material.â€
Guo Zhenluo, sales manager of Shenzhen Yuguangyu Technology Co., Ltd., said that the thermal conductivity of copper and aluminum substrates produced by them can reach 210W/(K*m).
The company's copper-aluminum substrate is based on the high thermal conductivity of copper but the price is expensive, and the heat dissipation per unit volume is worse than aluminum.
In fact, for this copper-aluminum meets the heat-dissipating substrate, many COB packaging companies are still holding a wait-and-see attitude. Some companies specializing in the production of LED heat-dissipating substrates are less optimistic about this material.
"With this heat-conducting substrate, the thermal resistance may be reduced, but the overall cost is improved." A research and development staff of a professional COB package in Shenzhen told reporters that improving the cost performance of COB devices should not only consider the improvement of parameters. There is also a need to consider cost issues, not to mention a material that is not very mature.
Yin Hui, director of sales of Ningbo Shengpu Optoelectronics, also told reporters, "We have been paying attention to copper and aluminum plates very early, but the technical difficulties have been difficult to overcome, and the price of copper and aluminum plates is relatively cheap." At the same time, he said that related technologies Before maturity, the enhanced spectrum optoelectronics will only try this substrate in small batches.
One key that cannot be ignored is the industry's application of heat-dissipating materials, focusing only on the heat dissipation coefficient, while ignoring the thermal resistance value.
"Whether it is a ceramic substrate or an aluminum substrate, a silver layer is applied to the surface for the purpose of conduction, so that a thermal resistance layer is formed between the heat source and the heat dissipation substrate," Lu Jiawen said.
The dielectric layer on most common heat-dissipating substrates has little thermal conductivity or even thermal conductivity, so that heat cannot be conducted from the LED chip to the heat-dissipating substrate, and the entire heat-dissipating channel cannot be unblocked. The heat accumulation will quickly lead to the LED chip. Invalid.
Therefore, the thermal resistance treatment is not good, not only does the heat not easily dissipate, but the silver-plated material also produces a common "vulcanization" phenomenon, and even a dead light.
The mirror aluminum heat sink substrate is used in this case in a large number of COB packages.
“Mirror aluminum substrate is a material developed based on traditional PCB hot spot separation technology and is specially used for high-power integrated light source such as COB.†Jian Yucang, general manager of Shenzhen Ruwei Electronics Co., Ltd., said that the use of mirror aluminum substrate can not only overcome Vulcanization, and faster heat dissipation, and light efficiency can be significantly improved.
It is understood that the mirror-coated aluminum COB package device directly attaches the chip to the mirror-processed aluminum substrate, which not only reflects other astigmatism, but also improves the light efficiency, and reduces the thermal resistance in the middle. The heat is directly from the chip. Passed to the heat sink substrate, the heat dissipation performance is significantly improved.
At the same time, the LED wire is wound on the outer insulating layer, and the light-emitting area and the solder joint are separated. Even if the solder joint is vulcanized, it will not affect the light emission of the chip.
"This kind of aluminum substrate is a boon for COB packaging companies, not only can improve the quality of device products, but also save them a lot of cost." Liu Wei, chairman of Zhejiang Yuanda Electronic Development Co., Ltd. said that Yuanda Electronics has realized In mass production, it can fully meet the needs of customers.
Benefiting from the growth of downstream demand, especially the demand for integrated light sources in the commercial lighting field is growing rapidly, and the demand for COB packaging is further improved. GLII expects that the COB packaging market this year will be expected to reach 15% to 20%.
Under the rapid growth of COB light source, the future heat sink substrate market will be more active. Whether the mirror aluminum substrate can withstand the challenges of various materials, you have to look at it.
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