This article is the speech of Xiao Guowei, President of Jingke Electronics (Guangzhou) Co., Ltd. at the 2014 High-Tech LED Annual Conference “On the Great Strategy of the Industryâ€.
Xiao Guowei said that the flip-chip LED process has no risk of disconnection, can withstand large currents, is easy to integrate with modules, and can achieve uniform coating of phosphors. Therefore, it is the best choice for CSP packaging.
The following is the full text of Xiao Guowei's speech:
Thank you, we are launching the package today. I don't think that no package is a scientific word. After all, I am engaged in technology. But the popular point is that there is no image of the package storm. I am here to communicate with you. In fact, for so many years, Jingke has done 12 years of flipping. I have never asked so many people like this year, in the end, your flip What is it like? Did you eat the package? This industry has become more and more bordered and blurred?
There is no packaging from a technical point of view, some of my personal understanding, and what kind of situation is behind.
Jingke Electronics has developed rapidly in recent years. At present, the registered capital is 70 million US dollars. Jingke has been transforming since 2010, and it has become a chip-package enterprise by a pure chip company.
Today, the industry has developed and I have carefully reviewed the process of industrial development in these years. The whole application field of LED has basically been carried out. In the past, due to the high cost, some aspects of the technology did not meet the requirements of the application field, but until now, more than 95% of the application fields can be cut, but still Some technologies, including cost and market, have to enter some high-application markets, such as medical lighting, and even this year, major optical communications have been implemented, and there are no obvious cases that cannot be implemented.
When it comes to the so-called unpackaged storm, everyone is concerned that the fundamental driving force of no package storm is the cost and technical improvement problem.
The impact of this change on the entire industry, especially the impact of the middle and upper reaches, has always been considered to be capacity, but in fact I think the market is the fundamental driving force, since the market requires. For the future market, I hope that our cost will drop by 20% to 30%, and even fall to half. I personally think that if we look at the system cost, it must be possible. But from the middle and upper reaches of the LED alone, this space is very small, that is, the material cost is small. However, we do not rule out that we have new ones. With the introduction of new technologies or the emergence of new technology routes, the cost of the entire lighting enterprise has dropped dramatically.
The reason why more and more companies are talking about flip-flops, when it comes to package-free, I think it was forced out. Why didn’t they three years ago? We can take a look. Two years ago, Jingke was in the whole industry. Everyone might know that like flip-chip, like chips, etc., Jingke Electronics is the most promoted in the industry, and there is another company. Because all of our products are these product lines. But today, many companies love to say one thing. In the centralized circuit, every colleague we are here today, if you are using a smart phone, the cores in your smartphone are all flipped, so-called dual core. The quad-core is actually implemented by flip-chip technology.
It is precisely because of this cost and the driving force of the whole market that the so-called flip-chip technology itself is inherently a combination of chip technology and packaging technology. Jingke Electronics has been providing customization until 2011. The products are given to our customers, but I think that starting in 2010, as long as I go out to speak, I will say that Jingke will do the packaging, because the flip-chip technology itself is the combination of package and chip, so the so-called no package or The so-called package-free, basically the technical route naturally set this gene.
The question is coming?
Many packaging companies will ask me, what should the packaging factory do?
The so-called no-package, if it is technically speaking, it is precisely the vertical integration of advanced chip technology and packaging technology. Basically, I think that with the current development requirements in the market, in the next one to two years, As long as the scale of the chip companies will secretly Chen Cang to do high-end CSP package.
Finally, downstream users further expand and develop, chip-level packaging, which has achieved industrial development ten years ago. Fundamentally speaking, it has compressed many industrial links of traditional packaging, and more importantly, it has saved a lot of material links.
The ultimate direction is to implement a white light chip, but for LEDs, there is a big difference, the photoelectric parameters are very complicated, and its phosphors and chips, at least the characteristics of the physical materials I see at present, are still very Difficult to achieve in 4 inches, 2 inches, if this can be done, it is possible that all the level of the packaging factory will do everything in the chip factory, but the current material characteristics are still difficult to achieve. So at this point, at least my personal understanding is that I can give the packaging factory a reassurance. Small and medium-sized packages still have considerable room for development and future market prospects.
With this development, is it true that unpackaged chips are packageless or gold-free? Or is it completely removed from the packaging? In fact, the encapsulation of this link still exists, is it only by the chip factory or by the packaging factory? Or is the chip factory doing a little more? Or the packaging factory is a little more dry, or a certain type of chip factory sees that the market advantage is more obvious, and some are still handed over to the traditional package to complete. The final determinant is actually determined by the end user, the lighting company and our consumer market.
But with the development of this technology, we need to pay attention to the downstream users. If the development of LED is going to the next peak, I personally think that the current technology is already in place, but it will extend a new one and promote innovation. A new light source mode or illumination mode. I hope that when this model emerges, through CSP, we can intelligentize the control chip, even some devices and functions. At this time, we can reflect on why I have such a large power box. Now it seems that the power of a lamp seems to be 2 yuan to 2.5 yuan a watt, to protect this price for five years. Some people may think that we are not enough.
But just now, the street lamp is now also making 6 yuan a watt. I think if you achieve this, there will be room for 6 yuan and watt, because you don't need structural parts. Why are your structural parts here? More so much PCB? Why are there so many ICPCB boards? Includes his kit. Some time ago, I was a big customer. I gave him a lighting plan. He sold the fluorescent lamp for five years. The last user came back and told him how to bend your lamp. The lamp is also guaranteed. The problem. Later, I found that the bending of the PCB board was narrower. He said that it accounted for 30% of the cost. Now the lamp is not cheap, it is cheap enough, accounting for 30% of the cost. I have to choose good materials, so why? What about the structure? Can you not?
This is achieved through a high voltage or communication scheme.
Therefore, when we see the so-called no-package or package-free storm, in the future, the real industrial high point and the larger market environment, due to the emergence of new technologies, I think it will bring more opportunities to our industry. And the opportunity, this is the fundamental growth point to grasp.
At least I think that LED has at least 10 years of development space in the future. I believe that the enjoyment of lighting and the experience of people are very rich and extensive, and its market space will be great!
It is precisely because of this that at present, due to the cost reduction, the integration of chips and packaging, for individual packaging companies, new innovations and new opportunities for the overall technology and environmental foundation, when we dig out, Will bring a better and broader market to the company.
Xiao Guowei said that the flip-chip LED process has no risk of disconnection, can withstand large currents, is easy to integrate with modules, and can achieve uniform coating of phosphors. Therefore, it is the best choice for CSP packaging.
The following is the full text of Xiao Guowei's speech:
Thank you, we are launching the package today. I don't think that no package is a scientific word. After all, I am engaged in technology. But the popular point is that there is no image of the package storm. I am here to communicate with you. In fact, for so many years, Jingke has done 12 years of flipping. I have never asked so many people like this year, in the end, your flip What is it like? Did you eat the package? This industry has become more and more bordered and blurred?
There is no packaging from a technical point of view, some of my personal understanding, and what kind of situation is behind.
Jingke Electronics has developed rapidly in recent years. At present, the registered capital is 70 million US dollars. Jingke has been transforming since 2010, and it has become a chip-package enterprise by a pure chip company.
Today, the industry has developed and I have carefully reviewed the process of industrial development in these years. The whole application field of LED has basically been carried out. In the past, due to the high cost, some aspects of the technology did not meet the requirements of the application field, but until now, more than 95% of the application fields can be cut, but still Some technologies, including cost and market, have to enter some high-application markets, such as medical lighting, and even this year, major optical communications have been implemented, and there are no obvious cases that cannot be implemented.
When it comes to the so-called unpackaged storm, everyone is concerned that the fundamental driving force of no package storm is the cost and technical improvement problem.
The impact of this change on the entire industry, especially the impact of the middle and upper reaches, has always been considered to be capacity, but in fact I think the market is the fundamental driving force, since the market requires. For the future market, I hope that our cost will drop by 20% to 30%, and even fall to half. I personally think that if we look at the system cost, it must be possible. But from the middle and upper reaches of the LED alone, this space is very small, that is, the material cost is small. However, we do not rule out that we have new ones. With the introduction of new technologies or the emergence of new technology routes, the cost of the entire lighting enterprise has dropped dramatically.
The reason why more and more companies are talking about flip-flops, when it comes to package-free, I think it was forced out. Why didn’t they three years ago? We can take a look. Two years ago, Jingke was in the whole industry. Everyone might know that like flip-chip, like chips, etc., Jingke Electronics is the most promoted in the industry, and there is another company. Because all of our products are these product lines. But today, many companies love to say one thing. In the centralized circuit, every colleague we are here today, if you are using a smart phone, the cores in your smartphone are all flipped, so-called dual core. The quad-core is actually implemented by flip-chip technology.
It is precisely because of this cost and the driving force of the whole market that the so-called flip-chip technology itself is inherently a combination of chip technology and packaging technology. Jingke Electronics has been providing customization until 2011. The products are given to our customers, but I think that starting in 2010, as long as I go out to speak, I will say that Jingke will do the packaging, because the flip-chip technology itself is the combination of package and chip, so the so-called no package or The so-called package-free, basically the technical route naturally set this gene.
The question is coming?
Many packaging companies will ask me, what should the packaging factory do?
The so-called no-package, if it is technically speaking, it is precisely the vertical integration of advanced chip technology and packaging technology. Basically, I think that with the current development requirements in the market, in the next one to two years, As long as the scale of the chip companies will secretly Chen Cang to do high-end CSP package.
Finally, downstream users further expand and develop, chip-level packaging, which has achieved industrial development ten years ago. Fundamentally speaking, it has compressed many industrial links of traditional packaging, and more importantly, it has saved a lot of material links.
The ultimate direction is to implement a white light chip, but for LEDs, there is a big difference, the photoelectric parameters are very complicated, and its phosphors and chips, at least the characteristics of the physical materials I see at present, are still very Difficult to achieve in 4 inches, 2 inches, if this can be done, it is possible that all the level of the packaging factory will do everything in the chip factory, but the current material characteristics are still difficult to achieve. So at this point, at least my personal understanding is that I can give the packaging factory a reassurance. Small and medium-sized packages still have considerable room for development and future market prospects.
With this development, is it true that unpackaged chips are packageless or gold-free? Or is it completely removed from the packaging? In fact, the encapsulation of this link still exists, is it only by the chip factory or by the packaging factory? Or is the chip factory doing a little more? Or the packaging factory is a little more dry, or a certain type of chip factory sees that the market advantage is more obvious, and some are still handed over to the traditional package to complete. The final determinant is actually determined by the end user, the lighting company and our consumer market.
But with the development of this technology, we need to pay attention to the downstream users. If the development of LED is going to the next peak, I personally think that the current technology is already in place, but it will extend a new one and promote innovation. A new light source mode or illumination mode. I hope that when this model emerges, through CSP, we can intelligentize the control chip, even some devices and functions. At this time, we can reflect on why I have such a large power box. Now it seems that the power of a lamp seems to be 2 yuan to 2.5 yuan a watt, to protect this price for five years. Some people may think that we are not enough.
But just now, the street lamp is now also making 6 yuan a watt. I think if you achieve this, there will be room for 6 yuan and watt, because you don't need structural parts. Why are your structural parts here? More so much PCB? Why are there so many ICPCB boards? Includes his kit. Some time ago, I was a big customer. I gave him a lighting plan. He sold the fluorescent lamp for five years. The last user came back and told him how to bend your lamp. The lamp is also guaranteed. The problem. Later, I found that the bending of the PCB board was narrower. He said that it accounted for 30% of the cost. Now the lamp is not cheap, it is cheap enough, accounting for 30% of the cost. I have to choose good materials, so why? What about the structure? Can you not?
This is achieved through a high voltage or communication scheme.
Therefore, when we see the so-called no-package or package-free storm, in the future, the real industrial high point and the larger market environment, due to the emergence of new technologies, I think it will bring more opportunities to our industry. And the opportunity, this is the fundamental growth point to grasp.
At least I think that LED has at least 10 years of development space in the future. I believe that the enjoyment of lighting and the experience of people are very rich and extensive, and its market space will be great!
It is precisely because of this that at present, due to the cost reduction, the integration of chips and packaging, for individual packaging companies, new innovations and new opportunities for the overall technology and environmental foundation, when we dig out, Will bring a better and broader market to the company.
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