LED technology needs more than 10 years of saturation

A seminar on LED technology organized by the Photonics Industry Association of Jiangmen National High-tech Zone was formally held on May 15th. Ye Guoguang, director of marketing center of Deli Optoelectronics Co., Ltd. of Guangdong, took the theme of “LED Latest Technology Introduction” and described the latest generation. LED technology - Flip Chip (flip chip) and no packaging process; other potential LED technology - GaN homogenous substrates, silicon substrates and other latest technology aspects.

The next five years are the times for patch sticking and contending:

1. In 2015, everyone can achieve 180 lumens per watt. Those that cannot be achieved will be eliminated.

2. Before 2015, the upstream market was still oversupply, and only technology could drive the LED market forward. High-current-density dress-up technology (SMD cost reduction) and flip-chip technology (easily package-integrated, reducing packaging costs) will be the mainstream.

3, disruptive technology (silicon substrate or homogeneous substrate) will never have an impact on the market.

4. After 2015, technology is no longer the dominant market force. Brands and special specifications are the market forces. LEDs will enter mature industries. There is a clear division of the world's pattern: upstream in East Asia, lighting is manufactured in mainland China, access and design are in Europe and the United States.

In addition, high-current drive is the best way to reduce costs.

No package is only suitable for some applications

The non-package process is actually an LED chip that does not require a packaging process and is coated with a phosphor, and is directly soldered to the circuit substrate by the SMT method. Currently, the company that develops this process includes: Epi-Electro Luminaires (ELC); Embedded Solar and TSMC-CSP (Chip Scale Package) wafer-level packaging; Jinke and New Century-FCOB (Flip Chip on) Board) LEDiS, Match.

Comparison between no package process and traditional package:

1. At present, the technological route of no packaging technology has been established, but it still takes time in the industrialization process, which is currently about 2-3 times the cost of the packaging process.

2. The optical problem has not yet been effectively solved. At present, there is no obvious advantage in brightness compared with the traditional package.

3. If this process is to be used, most of the key equipment needs to be updated, causing the overall cost to rise.

4, only suitable for part of the application products, such as in the lamp and other high-volume application products in this process can not be satisfied.