Japan's nuclear disaster affects European solar market

DIGITIMES Research pointed out that although the European market is still affected by uncertainties in Italy and Germany, it has caused a strong wait-and-see atmosphere. However, recently the market has reported that due to the nuclear disaster caused by the 311 earthquake in Japan, the Japanese government has not ruled out a new budget. The northeastern region that supports strong earthquakes has installed about 1 billion watts of solar energy system. The solar energy industry said that it is closely monitoring the trend of the news. In addition, the European market has been affected by Japan’s nuclear disaster, and it has already started to increase the price of electricity. As a result, solar photovoltaic development space will also increase. As a result, the industry expects that the recent battery-side production cuts and bargains are “dark before dawn”.

Although the European market was uncertain about the new subsidies from Italy and Germany, which led to a strong wait-and-see atmosphere that affected demand, the bargain hunting and production reduction issues began to ferment. However, solar energy companies said that the market conditions are not necessarily completely pessimistic and new demand has not slowed down.

The solar cell plant that has Japanese OEM orders revealed that the Japanese government recently reported that the Japanese government has been responsible for nuclear disasters, causing nuclear power, power outages, restoration of electricity, and strengthening the rapid growth of the renewable energy industry. The tsunami-affected northeastern region has set an additional budget and it is expected that about 1 billion watts of solar rooftop demand will come into being. At present, it is still not possible to determine the operational mode of the strategy. Japanese customers have been asked to pay more attention to facilitate the follow-up cooperation.

In addition to the Japanese market, the Italian market is also expected to announce a new subsidy policy on the 10th or so. The solar industry believes that the main reason for the freezing of demand from the Italian market is due to bank-side loans because there are no new subsidy rates. It is impossible to estimate the return on investment of the new system case. Due to fears that the rate cut will be higher than expected, many banks will gradually reduce their capital borrowings, wait to see the new rates and make decisions, and the funds for system installation will be further affected by bank attitudes. When it comes to freezing, once the new strategy is released, it also means that the funds on the system side can be thawed and started to run.

In addition, the solar energy industry analysts, regardless of the number of cuts in the Italian market subsidy, as long as there is no cap for the installation of subsidies, the currently mature Asian solar energy industry supply chain should have enough strength to compensate for government subsidies through price cuts. , cut down the reduced return on investment (IRR).

The most dramatic of these was the German market. Affected by Japan’s nuclear disaster, the German government, which had high anti-nuclear awareness, quickly shut down seven nuclear power plants established before 1980 and conducted comprehensive security checks to appease the people. The German government also Strengthen the amount of subsidies for renewable energy, especially to increase off-shore wind energy as an alternative to the power required to shut down 7 power plants. In addition, it also strengthens the basic grid-connected structure of solar photovoltaics.

However, the recent local elections in Germany were still affected by the Japanese nuclear disaster, which made the anti-nuclear German Green Party a big victory, and it is expected to win the Baden-Württemberg state together with another opposition Social Democratic Party, which seriously impacted Angela (Angela). Merkel's election to the next premier election highlights Merkel's efforts to retain power and restore the people's special effects. It may be a renewable energy policy, and the new solar energy subsidy policy to be implemented in July may bear the brunt of it.

In addition, foreign reports reported that the impact of Japan’s nuclear disaster, including Germany, Austria, the Czech Republic, Poland, and other European countries’ traditional electricity prices, has escalated, indicating that the traditional power generation and solar photovoltaic power generation costs are even closer (Grid-Parity) milestones. For the solar optoelectronics industry, the recent production cuts and bargains fall into the "darkness before dawn."


Electronic Pcb Assembly & Electronic PCBA Printed circuit boards assembly Manufacturing


Topscom offers PCB assembly services. These complement our expertise in electrical, mechanical and electro-mechanical contract assembly.


Our PCBA services encompass both through-hole (conventional) and surface mount (SMT) assembly capabilities. They range from initial production of prototypes

(as part of our NPI process), through to the ongoing manufacture of complex, multi-technology PCBAs, in low to medium volumes.

We produce both leaded and RoHS compliant products, utilising our five Mycronic surface mount placement machines for SMT assembly. Or, we can form, populate and solder through-hole components to PCBs, either by hand or by using our automatic soldering processes. 

PCB product realisation services
Our product realisation services take customers through from initial design concepts to full production. Our experienced account managers - along with our engineering, manufacturing and NPI teams - operate in partnership with our customers. We ensure successful new product introductions, on time and within budget.
DIPASSEMBLY
A typical TOPSCOM product realisation initiative includes:

Design support
DFx
 Design for procurement
 Design for manufacture
 Design for test
Prototypes
"Pilot" (NPI) builds
Volume build
PCB prototyping and NPI
pcba pcb assembly

Our NPI team uses a tried and tested approach, to deliver new product introductions.

Our use of advanced project management tools, including critical path analysis (along with common sense strategies, such as attention to detail and frequent communication), guides customers through the NPI process.

Beginning at the request for quotation (RFQ) stage, the NPI process involves our business development team reviewing the requirements of a product or project and analysing the build pack, data and specifications.

When we receive a purchase order, a formal handover process takes place. We then develop a comprehensive project plan. Our team uses detailed documentation, engineering change and reporting control, to ensure continued information integrity.

An experienced Account Manager acts as the interface between TOPSCOM and our customers. Although, at the same time, we encourage engineer-to-engineer communication. The designated project manager allocates resources and tracks all tasks throughout the NPI process. The result is a seamless transition into manufacturing.

SMT PCB assembly
smt pcb assembly

Since we first complemented our through-hole (conventional) PCB assembly services, by offering customers the ability to place surface mount (SMT) devices, the technology has progressed.

Yet, TOPSCOM has invested in people, processes and some of the finest equipment available. This approach has enabled us to deliver to customers' requirements - in terms of flexibility, responsiveness, quality and lead-times.

We have five Mycronic surface mount placement machines, configured as three fully integrated lines, for the main production. Each line has a DEK Horizon or 265 printer and a BTU 8 zone oven, connected with automatic conveyors and loaders/unloaders, and an in-line Mirtec AOI system. Also, we have invested in off-line setup facilities, including Agilis feeders, to allow the rapid and accurate changeover of jobs.

TOPSCOM`s Mycronic placement machines use rapid-change intelligent feeders that can handle components from 01005 resistors to ball grid array (BGA), and fine pitch devices up to 70mm2. All common (and less common) PCB substrate materials are populated, including FR4, flexi, flexi-rigid and metal backed laminates. Pb (if RoHS exempt) and RoHS compliant Pb-free processes are available, both to IPC-A-610 class 2 or 3 as required.

Solder paste printing is a critical process, which our DEK automatic printers achieve accurately and consistently. They have built-in, automatic optical inspection for verification, "GridLok" PCB supports, and "ProActiv" for ultra-fine pitch printing.

Solder paste reflow is carefully profiled and processed using BTU Pyramax 100A8-zone convection ovens. Our SMT processes are supported by experienced IPC trained technicians, using the latest technology equipment for process set-up and verification. All SMT assemblies are AOI inspected, using in-line and Mirtec AOI systems. First-off verification is assisted using "Extra Eye" guided inspection, with microscopes, Ersa Scope and X-ray available for fine pitch and BGA inspection.

Our materials control facilities include baking ovens and dry storage chambers for correct conditioning and storage of components and assemblies. For modifications and upgrades, two fully equipped fine pitch/BGA re-work stations are available.

Conventional PCB assembly
pcb assembly 

As well as investing in surface mount technology, TOPSCOM Manufacturing also has a fully equipped through-hole facility.

These IPC-A-610 trained operators and technicians have an array of tools and equipment at their disposal, to enable them to perform all the operations required by TOPSCOM`s customers. Through-hole components are formed, populated and soldered by hand or automatic soldering processes.

Three dedicated Blundell CMS400(LF) wave solder machines offer volume soldering capability for tin-lead and unleaded solder, depending on the RoHS status of the product being assembled. Manual conformal coating and encapsulation services are also available if required, for customers whose products operate in environments where safety, security or humidity are an issue. With both leaded and lead-free soldering, we have no-clean, solvent, ultrasonic and aqueous cleaning processes available.

The through-hole process can be completed with functional or Teradyne in-circuit ATE test, before shipment or inclusion in the next build process.

WATCH THE VIDEO
PCB Assembly
PCB test and inspection
TOPSCOM is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers' time and money downstream by reducing field failures.

We develop sound test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.

Every PCBA undergoes full, high-resolution AOI inspection through Mirtec MV-3L machines on each line, with images retained for several months. All boards are traceable by the individual bar code. A rigorous first-off inspection process is performed on each build, complemented by a robust NPI procedure for new products.

All TOPSCOM production staff are IPC trained and attend residential courses with the equipment manufacturers, as well as ongoing training and development. Build documents and machine programs are produced from customer`s CAD information using Aegis CircuitCAM processing software, with DFT/DFM advice given before committing to orders. This all results in process quality exceeding 5 Sigma. Advanced Ersa rework stations are available for product upgrades and repair of field returns.

Our in-depth technical assessment is based on the following considerations:

Product design requirements
Testability requirements
Component types
Product complexity
Manufacturing process
Product maturity
Product lifecycle implications
By assessing the above factors in detail, we can predict the defects most likely to occur in the manufacturing process. Our customers have boosted both the cost effectiveness and reliability of their end products, by taking this assessment into account. 

Since we offer an extensive range of test options, we will provide the most appropriate test strategy for your products.


Electronic Assembly

Electronic Assembly,Electronics Assembly Pcba,Professional Electronics Assembly,Electronic Pcb Assembly Service,PCBA Assembly

Topscom Technology Co., Ltd. , http://www.pcbassemblycn.com

Posted on