Dialog Semiconductor Co., Ltd. has announced the world's first 2D/3D image conversion real-time processing chip: DA8223. This chip provides real-time conversion of 2D/3D video images for various portable devices including smartphones and tablets. Features. The device also integrates a parallax barrier screen driver that allows users to view 3D content without the need for glasses.
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The chip analyzes each frame of 2D video images and creates a layered depth map (Z-depth) by separating the foreground image from the background image. Thus, each original image pixel is mapped to the left and right eyes, and when viewed through a display with a parallax barrier, the 3D image effect can be directly rendered. The DA8223 integrates a complete 2D/3D image conversion algorithm that does not impose an additional burden on the main application processor in 2D/3D image conversion compared to traditional software-based solutions, and does not require external memory. .
“At present, the demand for 3D image effects on smartphones has arrived, but there are currently very few 3D effects. By using DA8223, you can create a truly unique and instantly let-free battery without affecting battery life. Users experience unlimited 3D content devices," said Mark Tyndall, vice president of corporate development and strategy at Dialog Semiconductor.
"The DA8223 is the first hardware-based solution to optimize 2D/3D image conversion technology for a variety of portable devices. It does not require software development in practice, and it is based on software implementations based on the application processor. Than, its demand for battery and computing power is minimal," Mark added.
By supporting images and video at 60 frames per second, the system can display 3D content in real-time through both horizontal and vertical formats. The DA8223 ensures a richer and more comfortable 3D viewing experience for virtually 2D content, even in Super Used for a long time.
The DA8223 is compatible with the widest range of 3D capable displays from 3.8-inch smartphones to 10-inch tablets. It can also be used with any display device equipped with a parallax barrier, including OLEDs and the latest TFT displays from Sharp.
The 5x5mm, 81-ball UFBGA package can be mounted on a printed circuit board between the application processor and the 3D display, or mounted on the display module using the COF process. Samples of the device will be available in early 2011 to ensure mass production of handheld products in the second half of 2011.
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